 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6415 Issued Date : 1992.11.25 Revised Date : 2002.02.05 Page No. : 1/4 HBC337 NPN EPITAXIAL PLANAR TRANSISTOR Description The HBC337 is designed for driver and output-stage of audio amplifiers. Features * High DC Current Gain: 100-600 at IC=100mA,VCE=1V * Complementary to HBC327 TO-92 Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 625 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ......................................................................................... 50 V VCEO Collector to Emitter Voltage ...................................................................................... 45 V VEBO Emitter to Base Voltage .............................................................................................. 5 V IC Collector Current ....................................................................................................... 800 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) VBE(on) *hFE1 *hFE2 fT Cob Min. 50 45 5 100 40 Typ. 210 4 Max. 100 0.7 1.2 600 Unit V V V nA V V Test Conditions IC=100uA, IE=0 IC=10mA, IB=0 IE=10uA, IC=0 VCB=45V, IE=0 IB=500mA, IB=50mA IC=300mA, VCE=1V VCE=1V, IC=100mA VCE=1V, IC=300mA VCE=5V, IC=10mA, f=100MHZ VCB=10V, IE=0, f=1MHZ *Pulse Test: Pulse Width 380us, Duty Cycle2% MHZ pF Classification of hFE1 Rank Range 16 100-250 25 160-400 40 250-600 HBC337 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 125 C o Spec. No. : HE6415 Issued Date : 1992.11.25 Revised Date : 2002.02.05 Page No. : 2/4 Saturation Voltage & Collector Current 1000 VCE(sat) @ IC=10IB 25 C o 75 C o 100 Saturation Voltage (mV) hFE 100 75 C o 125 C o o hFE @ VCE=1V 10 1 10 100 1000 10 0.1 1 25 C 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) ON Voltage & Collector Current 1000 Capacitance & Reverse-Biased Voltage 100 25 C o 75 C 125 C o o Capacitance (pF) ON Voltage (mV) 10 Cob VBE(ON) @ VCE=1V 100 0.1 1 10 100 1000 1 0.1 1 10 100 Collector Current-IC (mA) Reverse-Biased Voltage (V) Cutoff Frequency & Collector Current 1000 10000 Safe Operating Area PT=1ms PT=100ms Cutoff Frequency (MHz).. . Collector Current-IC (mA) 1000 PT=1s VCE=5V 100 100 10 10 1 10 100 1000 1 1 10 100 Collector Current (mA) Forward Voltage-VCE (V) HBC337 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6415 Issued Date : 1992.11.25 Revised Date : 2002.02.05 Page No. : 3/4 PD-Ta 700 600 Power Dissipation-PD (mW) 500 400 300 200 100 0 0 50 100 o 150 200 Ambient Temperature-Ta ( C) HBC337 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6415 Issued Date : 1992.11.25 Revised Date : 2002.02.05 Page No. : 4/4 2 Marking: H BC 337 Control Code 3 C Style: Pin 1.Collector 2.Base 3.Emitter D H I E F G 1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HBC337 HSMC Product Specification |
Price & Availability of HBC337
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |